This Navy ManTech effort to develop a manufacturing process for HTSDG is required to ensure successful full-scale implementation on a future surface combatant. ONR photo
The objective of this Navy Metalworking Center project was to improve the manufacturability within two key areas of this system to enable full-scale production and near-term implementation for future Navy platforms.
The implementation of a High Temperature Superconducting Degaussing (HTSDG) system on a future surface combatant is currently in progress under the leadership of the Naval Surface Warfare Center, Carderock Division (NSWCCD).
The first focus area was to develop a process for an efficient, robust, repeatable solder joint connection between an HTS wire and copper pin where joint visibility is restricted and minimal heat must be used. The Integrated Project Team (IPT) developed and validated a customized induction heating system to solder these critical joints that met all physical and functional requirements. Within the second focus area, the IPT developed a proprietary high-yield process to bundle the uniquely shaped HTS wire that does not impart mechanical damage to any of the individual wires or damage to the insulation on those wires.
In addition to anticipated cost avoidance, additional benefits include increased HTSDG system reliability; reduced lead times, which mitigates schedule risk to the Navy; and increased HTSDG cable capacity.
AMSC will implement the manufacturing solutions pending a full HTSDG shipset order from the Navy .
Naval Surface Warfare Center, Carderock Division
PMS 501 Littoral Combat Ship Program Office